Liquid Non-Silicone Thermal Interface Material "N-putty Series"
The thermal conductivity is 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components.
The "N-putty series" is a liquid non-silicone thermal interface material made from non-silicone resin. Since there is no volatilization of low molecular siloxane, it does not lead to poor electronic circuit connections. Additionally, N700 has flexible properties with good thermal conductivity and low thermal resistance. The thermal conductivity ranges from 1.5 to 3.0 W/m*K, making it suitable for optical products and sensitive electronic components, and it is an appropriate product for automated production lines using our developed dispenser. 【Product Lineup】 ■N-putty ■N-putty2 *For more details, please download the PDF (English version) or feel free to contact us.
- Company：日本旭立科技
- Price：Other
